Flotherm Cuts in Half the Cost of Stacked Module Potting Compound

Thermal simulation on initial concept design faster and less expensive than handling prototypes.

by DE Editors | Published July 15, 2008

C-MAC reduces cost of stacked module potting compound by 50 percent using Flotherm.

C-MAC MicroTechnology (Great Yarmouth, UK) used Flomerics' (Marlborough, MA) Flotherm thermal simulation software to determine that the thermal requirements of a stacked module could be met with a potting compound that cost only half the amount of the default choice.

C-MAC, an electronics design and manufacturing company, recently developed a stacked module for a critical defense application. Prior to building prototypes, C-MAC engineers performed thermal simulation on the initial concept design and discovered that junction temperatures on the module ranged up to 125 degrees C, well above the 100 degrees C maximum.

C-MAC realized it needed a potting compound to reduce thermal resistance and wanted to select the least expensive formulation that would meet the thermal requirements of the application. Compound type: simulated junction temperature — Standard (110 degrees C); Enhanced (85 degrees C); and Best (75 degrees C).

For more information about Flotherm, visit Flomerics.

Sources: Press materials received from the company and additional information gleaned from the company's website.

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